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Enhanced Thermoelectricity in High-Temperature beta-Phase Copper(I) Selenides Embedded with Cu2Te Nanoclusters
Butt, S; Xu W(徐伟); Xu, W; Farooq, MU; Ren, GK; Zhang, QH; Zhu, YC; Khan, SU; Liu, LJ; Yu, MJ; Mohmed, F; Lin, YH; Nan, CW; Zhu YC(朱英才); Yu MJ(于梅娟)
2016
发表期刊ACS APPLIED MATERIALS & INTERFACES
卷号8期号:24页码:15196-15204
文章类型期刊论文
摘要We report remarkably enhanced thermoelectric performance of Te doped Cu2Se in midtemperature range. Through ball-milling process followed by spark plasma sintering (SPS), nanoscale Cu2Te clusters were embeded in the matrix of Cu2Se, inducing a drastic enhancement of thermoelectric performance by reducing the thermal conductivity without degrading the power factor. A large ZT value of 1.9 was achieved at 873 K for Cu2Se1.9Te0.1, which is about 2 times larger than that of the pure Cu2Se. The nanoscale heat management by Cu2Te nanoclusters in superionic conductors opens up an avenue for thermoelectric materials research.
关键词Cu2Se Cu2Te nanoclusters nanoscale heat management superionic conductors ZT
DOI10.1021/acsami.6b02086
关键词[WOS]ULTRALOW THERMAL-CONDUCTIVITY ; PERFORMANCE ; SCATTERING ; CRYSTALS ; CU2SE ; TRANSFORMATION ; CERAMICS ; ELECTRON ; CUSE
语种英语
WOS类目Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS记录号WOS:000378584800035
引用统计
被引频次:7[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.ihep.ac.cn/handle/311005/260298
专题多学科研究中心
作者单位中国科学院高能物理研究所
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GB/T 7714
Butt, S,Xu W,Xu, W,et al. Enhanced Thermoelectricity in High-Temperature beta-Phase Copper(I) Selenides Embedded with Cu2Te Nanoclusters[J]. ACS APPLIED MATERIALS & INTERFACES,2016,8(24):15196-15204.
APA Butt, S.,徐伟.,Xu, W.,Farooq, MU.,Ren, GK.,...&于梅娟.(2016).Enhanced Thermoelectricity in High-Temperature beta-Phase Copper(I) Selenides Embedded with Cu2Te Nanoclusters.ACS APPLIED MATERIALS & INTERFACES,8(24),15196-15204.
MLA Butt, S,et al."Enhanced Thermoelectricity in High-Temperature beta-Phase Copper(I) Selenides Embedded with Cu2Te Nanoclusters".ACS APPLIED MATERIALS & INTERFACES 8.24(2016):15196-15204.
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