[Zhang Ai-Mei] Hohai Univ, Coll Sci, Nanjing 210098, Peoples R China
; [Zhang Ai-Mei
; Cai Hong-Ling
; Zhai Zhang-Yin
; Du Jun
; Wu Xiao-Shan] Nanjing Univ, Solid State Microstruct Lab, Dept Phys, Nanjing 210093, Peoples R China
; [Jia Quan-Jie] CAS, BSRF, Inst High Energy Phys, Beijing 100049, Peoples R China
Microstructure of NiO-containing Co/Cu/Co spin valves (CCC-SV) annealed at room temperature for nearly four years has been studied by synchrotron radiation X-ray diffraction. With the annealing time expanding, the thickness of each sub-layer remains nearly unchanged while the interface roughness varies obviously compared with that of samples without annealing. The roughness at the interface of NiO/Co decreases with the annealing time increasing for both of the samples with NiO layer on the top (TSV) and under the bottom (BSV) of CCC-SV. On the other hand, the roughness at Co/Cu interface increases with the annealing time expanding for BSV while it decreases for TSV. These results indicate that the structure of TSV is more stable than that of BSV.