Tomographic observation of integrated circuit based on X-ray microscopy
Xi; XQ; Li; L; Yan; B; Deng; L; Han; Y; Zhang; K; Zhang K(张凯)
刊名Proceedings of SPIE
2015
卷号9672页码:96720R
关键词Integrated circuit nanotomography X-ray microscopy Three-dimensional imaging BSRF
学科分类Engineering; Optics; Physics
DOI10.1117/12.2199840
文章类型Proceedings Paper
英文摘要Three-dimensional observation for the integrated circuit is of potential interest to an improved understanding of the formation of embedded voids in the copper interconnects, which has become major reliability concern in achieving high-performance microprocessors. Nano-scale line width requires the imaging technique with a high spatial resolution as well as penetration through several microns of silicon to maintain the sample integrity. The resolution of Optical microscopy is not enough and the electron microscopy requires invasive sample cross-sectioning, not permitting the in situ identification. The utilization of non-destructive imaging using 3D x-ray microscopy offers the needed resolution and penetration ability without significant damage. In this paper, the ability to image tomographically voids in copper interconnects and the seven metallization layers are demonstrated with bright contrast and a sub-50nm resolution on 8keV BSRF X-ray microscope. The sample is specifically prepared for this initial experiment, with a diameter of similar to 10.3 mu m and a thickness of 15.7 mu m. In the future experiment we are attempting to image the sample in its original state with only the backside silicon substrate removed, realizing the more non-destructive observation.
类目[WOS]Engineering, Electrical & Electronic ; Optics ; Physics, Applied
收录类别EI ; CPCI
WOS记录号WOS:000364672200036
引用统计
文献类型期刊论文
条目标识符http://ir.ihep.ac.cn/handle/311005/229075
专题中国科学院高能物理研究所_多学科研究中心_期刊论文
推荐引用方式
GB/T 7714
Xi,XQ,Li,et al. Tomographic observation of integrated circuit based on X-ray microscopy[J]. Proceedings of SPIE,2015,9672:96720R.
APA Xi.,XQ.,Li.,L.,Yan.,...&张凯.(2015).Tomographic observation of integrated circuit based on X-ray microscopy.Proceedings of SPIE,9672,96720R.
MLA Xi,et al."Tomographic observation of integrated circuit based on X-ray microscopy".Proceedings of SPIE 9672(2015):96720R.
条目包含的文件
文件名称/大小 文献类型 版本类型 开放类型 使用许可
5150.pdf(467KB)期刊论文作者接受稿开放获取CC BY-NC-SA浏览 请求全文
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[Xi]的文章
[XQ]的文章
[Li]的文章
百度学术
百度学术中相似的文章
[Xi]的文章
[XQ]的文章
[Li]的文章
必应学术
必应学术中相似的文章
[Xi]的文章
[XQ]的文章
[Li]的文章
相关权益政策
暂无数据
收藏/分享
文件名: 5150.pdf
格式: Adobe PDF
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。