Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation
Wang, TM; Zhou, P; Cao, F; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX; Huang WX(黄万霞); Yuan QX(袁清习)
刊名INTERMETALLICS
2015
卷号58页码:84-90
关键词In situ X-ray Intermetallics Crystal growth Microstructure
学科分类Chemistry; Materials Science; Metallurgy & Metallurgical Engineering
DOI10.1016/j.intermet.2014.11.010
文章类型Article
英文摘要High resolution time-resolved X-ray imaging with synchrotron radiation has been used to in situ observe the growth behavior of Cu6Sn5 intermetallic compounds (IMCs) during solidification in Sn-6.5 Cu and Sn-6.5 Cu-0.2 Al (wt. %) solders under applied direct current (DC) field. The morphological evolution of Cu6Sn5 with I-like, X-like, Y-like and bird-like shapes is directly observed. It is shown that trace levels of Al have a marked effect on the solder microstructures and refining the size of the primary Cu6Sn5. The solidification pathway leading to the refinement is observed in real time using synchrotron microradiography. After adding the trace Al, I-like shapes bifurcate into X-like shapes. Furthermore, when DC field with 10 A/cm(2) is applied, both the growth rate and the mean size of Cu6Sn5 are increased but decreased when 100 A/cm(2) is applied. Meanwhile, the effect of thermodynamic potential barrier caused by DC field on the growth behavior of Cu6Sn5 is discussed. (C) 2014 Elsevier Ltd. All rights reserved.
类目[WOS]Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
收录类别SCI ; EI
WOS记录号WOS:000348626600013
引用统计
被引频次:8[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.ihep.ac.cn/handle/311005/228084
专题中国科学院高能物理研究所_多学科研究中心_期刊论文
中国科学院高能物理研究所_多学科研究中心
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Wang, TM,Zhou, P,Cao, F,et al. Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation[J]. INTERMETALLICS,2015,58:84-90.
APA Wang, TM.,Zhou, P.,Cao, F.,Kang, HJ.,Chen, ZN.,...&袁清习.(2015).Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation.INTERMETALLICS,58,84-90.
MLA Wang, TM,et al."Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation".INTERMETALLICS 58(2015):84-90.
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