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Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation
Wang, TM; Zhou, P; Cao, F; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX; Huang WX(黄万霞); Yuan QX(袁清习)
2015
发表期刊INTERMETALLICS
卷号58页码:84-90
文章类型Article
摘要High resolution time-resolved X-ray imaging with synchrotron radiation has been used to in situ observe the growth behavior of Cu6Sn5 intermetallic compounds (IMCs) during solidification in Sn-6.5 Cu and Sn-6.5 Cu-0.2 Al (wt. %) solders under applied direct current (DC) field. The morphological evolution of Cu6Sn5 with I-like, X-like, Y-like and bird-like shapes is directly observed. It is shown that trace levels of Al have a marked effect on the solder microstructures and refining the size of the primary Cu6Sn5. The solidification pathway leading to the refinement is observed in real time using synchrotron microradiography. After adding the trace Al, I-like shapes bifurcate into X-like shapes. Furthermore, when DC field with 10 A/cm(2) is applied, both the growth rate and the mean size of Cu6Sn5 are increased but decreased when 100 A/cm(2) is applied. Meanwhile, the effect of thermodynamic potential barrier caused by DC field on the growth behavior of Cu6Sn5 is discussed. (C) 2014 Elsevier Ltd. All rights reserved.
关键词In situ X-ray Intermetallics Crystal growth Microstructure
学科领域Chemistry; Materials Science; Metallurgy & Metallurgical Engineering
DOI10.1016/j.intermet.2014.11.010
收录类别SCI ; EI
WOS类目Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000348626600013
引用统计
被引频次:11[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.ihep.ac.cn/handle/311005/228084
专题多学科研究中心
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GB/T 7714
Wang, TM,Zhou, P,Cao, F,et al. Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation[J]. INTERMETALLICS,2015,58:84-90.
APA Wang, TM.,Zhou, P.,Cao, F.,Kang, HJ.,Chen, ZN.,...&袁清习.(2015).Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation.INTERMETALLICS,58,84-90.
MLA Wang, TM,et al."Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation".INTERMETALLICS 58(2015):84-90.
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