Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography
Wang, TM; Cao, F; Zhou, P; Kang, HJ; Chen, ZN; Fu, YN; Xiao, TQ; Huang, WX; Yuan, QX;黄万霞; Yuan QX(袁清习)
刊名JOURNAL OF ALLOYS AND COMPOUNDS
2014
卷号616页码:550-555
关键词Interface diffusion Crystal growth Diffusion coefficient Al/Cu bimetal Synchrotron radiation
学科分类Chemistry; Materials Science; Metallurgy & Metallurgical Engineering
DOI10.1016/j.jallcom.2014.07.172
英文摘要Synchrotron X-ray radiography was used to in situ study the interface diffusion behavior and microstructural evolution during the melting and solidification of Al/Cu bimetal. During the solidification, the dendritic growth around the interface is mainly dominated by the variation of Cu concentration and thermal field. Four transition zones of solute profile around the interface were identified to be I (alpha-Al), II (Al + Al2Cu), III (Al2Cu) and IV (AlCu, Al3Cu4 and Al2Cu3), respectively. During the melting, the concentration variations of Al and Cu around the interface were quantitatively analyzed through the extraction of gray level from sequenced X-ray images. The diffusion coefficients of Cu in liquid Al were calculated from the known concentration variations by an inverse method based on Fick's second law. The diffusion coefficients of Cu in Al were found to follow linear Arrhenius equation dependencies with the pre-exponential factor of 2.83 x 10(-5) m(2) s(-1) and the activation energy of 96.0 kJ mol(-1) in a temperature range of 893-970 K. (C) 2014 Elsevier B.V. All rights reserved.
收录类别SCI
WOS记录号WOS:000342654000082
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被引频次:11[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.ihep.ac.cn/handle/311005/225054
专题中国科学院高能物理研究所_多学科研究中心_期刊论文
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Wang, TM,Cao, F,Zhou, P,et al. Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2014,616:550-555.
APA Wang, TM.,Cao, F.,Zhou, P.,Kang, HJ.,Chen, ZN.,...&袁清习.(2014).Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography.JOURNAL OF ALLOYS AND COMPOUNDS,616,550-555.
MLA Wang, TM,et al."Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography".JOURNAL OF ALLOYS AND COMPOUNDS 616(2014):550-555.
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